Methods and apparatus for cleaning substrates

ABSTRACT

The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a 371 national stage entry of and claims priority to International Application No. PCT/CN2016/099303, filed Sep. 19, 2019 and titled “METHODS AND APPARATUS FOR CLEANING SUBSTRATES,” which is hereby incorporated by reference in its entirety.

FIELD OF THE INVENTION

The present invention generally relates to method and apparatus for cleaning substrate. More particularly, relates to controlling the bubble cavitation generated by ultra or mega sonic device during the cleaning process to achieve a stable or controlled cavitation on the entire substrate, which removes fine particles efficiently in vias, trenches or recessed areas with high aspect ratio.

BACKGROUND

Semiconductor devices are manufactured or fabricated on semiconductor substrates using a number of different processing steps to create transistor and interconnection elements. Recently, the transistors are built from two dimensions to three dimensions such as finFET transistors and 3D NAND memory. To electrically connect transistor terminals associated with the semiconductor substrate, conductive (e.g., metal) trenches, vias, and the like are formed in dielectric materials as part of the semiconductor device. The trenches and vias couple electrical signals and power between transistors, internal circuit of the semiconductor devices, and circuits external to the semiconductor device.

In forming the finFET transistors and interconnection elements on the semiconductor substrate may undergo, for example, masking, etching, and deposition processes to form the desired electronic circuitry of the semiconductor devices. In particular, multiple masking and plasma etching step can be performed to form a pattern of finFET, 3D NAND flash cell and or recessed areas in a dielectric layer on a semiconductor substrate that serve as fin for the transistor and or trenches and vias for the interconnection elements. In order to removal particles and contaminations in fin structure and or trench and via post etching or photo resist ashing, a wet cleaning step is necessary. Especially, when device manufacture node migrating to 14 or 16 nm and beyond, the side wall loss in fin and or trench and via is crucial for maintaining the critical dimension. In order to reduce or eliminate the side wall loss, it is important to use moderate, dilute chemicals, or sometime de-ionized water only. However, the dilute chemical or de-ionized water usually is not efficient to remove the particles in the fin structure, 3D NAND hole and or trench and via. Therefore the mechanical force such as ultra or mega sonic is needed in order to remove those particles efficiently. Ultra sonic or mega sonic wave will generate bubble cavitation which applies mechanical force to substrate structure, the violent cavitation such as transit cavitation or micro jet will damage those patterned structures. To maintain a stable or controlled cavitation is key parameters to control the mechanical force within the damage limit and at the same time efficiently to remove the particles. In the 3D NAND hole structure, the transit cavitation may not damage the hole structure, but however, the bubble cavitation saturated inside hole will stop or reduce the cleaning effects.

Mega sonic energy coupled with nozzle to clean semiconductor wafer is disclosed in U.S. Pat. No. 4,326,553. The fluid is pressurized and mega sonic energy is applied to the fluid by a mega sonic transducer. The nozzle is shaped to provide a ribbon-like jet of cleaning fluid vibrating at ultra/mega sonic frequencies for the impingement on the surface.

A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid is disclosed in U.S. Pat. No. 6,039,059. In one arrangement, fluid is sprayed onto both sides of a wafer while a probe is positioned close to an upper side. In another arrangement, a short probe is positioned with its end surface close to the surface, and the probe is moved over the surface as wafer rotates.

A source of energy vibrates a rod which rotates around it axis parallel to wafer surface is disclosed in U.S. Pat. No. 6,843,257 B2. The rod surface is etched to curve groves, such as spiral groove.

It is needed to have a better method for controlling the bubble cavitation generated by ultra or mega sonic device during the cleaning process to achieve a stable or controlled cavitation on the entire substrate, which removes fine particles efficiently in vias, trenches or recessed areas with high aspect ratio.

SUMMARY

One method of the present invention is to achieve a damage free ultra/mega-sonic cleaning on a wafer with patterned structure by maintaining a stable bubble cavitation. The stable bubble cavitation is controlled by setting a sonic power supply with power P₁ at a time interval shorter than τ₁, and setting the sonic power supply with power P₂ at a time interval longer than τ₂, and repeat above steps till the wafer is cleaned, where power P₂ is equal to zero or much smaller than power P₁, τ₁ is a time interval that the temperature inside bubble raises to a critical implosion temperature; and τ₂ is a time interval that the temperature inside bubble falls down to a temperature much lower than the critical implosion temperature.

Another method of the present invention is to achieve a damage free ultra/mega sonic cleaning on a wafer with patterned structure by maintaining a stable bubble cavitation. The stable bubble cavitation is controlled by setting a sonic power supply with frequency f₁ at a time interval shorter than τ₁, and setting the sonic power supply with frequency f₂ at a time interval longer than τ₂, and repeat above steps till the wafer is cleaned, where f₂ is much higher than f₁, better to be 2 times or 4 times higher, τ₁ is a time interval that the temperature inside bubble raises to a critical implosion temperature; and τ₂ is a time interval that the temperature inside bubble falls down to a temperature much lower than the critical implosion temperature.

Another method of the present invention is to achieve a damage free ultra/mega-sonic cleaning on a wafer with patterned structure by maintaining a stable bubble cavitation with bubble size less than space in patterned structure. The stable bubble cavitation with bubble size less than space in patterned structure is controlled by setting a sonic power supply at power P₁ for a time interval shorter than τ₁, and setting the sonic power supply at power P₂ for a time interval longer than τ₂, and repeat above steps till the wafer is cleaned, where P₂ is equal to zero or much smaller than P₁, τ₁ is a time interval that the bubble size increases to a critical size equal to or larger than the space in patterned structures; and τ₂ is a time interval that the bubble size decreases to a value much smaller than the space in patterned structure.

Another method of the present invention is to achieve a damage free ultra/mega-sonic cleaning on a wafer with patterned structure by maintaining a stable bubble cavitation with bubble size less than space in patterned structure. The stable bubble cavitation with bubble size less than space in patterned structure is controlled by setting a sonic power supply with frequency f₁ for a time interval shorter than τ₁, and setting the sonic power supply with frequency f₂ for a time interval longer than τ₂, and repeat above steps till the wafer is cleaned, where f₂ is much higher than f₁, better to be 2 times or 4 times higher, τ₁ is a time interval that the bubble size increases to a critical size equal to or larger than the space in patterned structures; and τ₂ is a time interval that the bubble size decreases to a value much smaller than the space in patterned structure.

One method of the present invention is to achieve an effective ultra/mega-sonic cleaning on a substrate with features of deep holes by maintaining a non-saturated bubble cavitation. The non-saturated bubble cavitation is controlled by setting a sonic power supply with power P₁ at a time interval shorter than τ₁, and setting the sonic power supply with power P₂ at a time interval longer than τ₂, and repeating above steps till the substrate is cleaned, where power P₂ is equal to zero or much smaller than power P₁, τ₁ is a time interval that the cavitation or bubble density inside the deep hole raises to saturated status; and τ₂ is a time interval that bubble density falls down to a level much lower than the saturated status.

Another method of the present invention is to achieve an effective ultra/mega-sonic cleaning on a substrate with features of deep holes by maintaining a non-saturated bubble cavitation. The non-saturated bubble cavitation is controlled by setting a sonic power supply with frequency f₁ at a time interval shorter than τ₁, and setting the sonic power supply with frequency f₂ at a time interval longer than τ₂, and repeating above steps till the substrate is cleaned, where f₂ is much higher than f₁, better to be 2 times or 4 times higher, τ₁ is a time interval that the cavitation or bubble density inside the deep hole raises to saturated status; and τ₂ is a time interval that bubble density falls down to a level much lower than the saturated status.

One method of the present invention is to achieve an effective ultra/mega-sonic cleaning on a substrate with features of deep holes by maintaining a certain size of bubble in cavitation status. The certain size of bubble in cavitation status is controlled by setting a sonic power supply with power P₁ at a time interval shorter than τ₁, and setting the sonic power supply with power P₂ at a time interval longer than τ₂, and repeating above steps till the substrate is cleaned, where power P₂ is equal to zero or much smaller than power P₁, τ₁ is a time interval that the cavitation or bubble density inside the deep hole raises to saturated status; and τ₂ is a time interval that bubble size falls down to a level much smaller than the certain size.

Another method of the present invention is to achieve an effective ultra/mega-sonic cleaning on a substrate with features of deep holes by maintaining a certain size of bubble in cavitation status. The certain size of bubble in cavitation status is controlled by setting a sonic power supply with frequency f₁ at a time interval shorter than τ₁, and setting the sonic power supply with frequency f₂ at a time interval longer than τ₂, and repeating above steps till the substrate is cleaned, where f₂ is much higher than f₁, better to be 2 times or 4 times higher, ii is a time interval that the cavitation or bubble density inside the deep hole raises to saturated status; and τ₂ is a time interval that bubble size falls down to a level much smaller than the certain size.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1B depict an exemplary wafer cleaning apparatus using ultra/mega sonic device;

FIGS. 2A-2G depict variety of shape of ultra/mega sonic transducers;

FIG. 3A depicts bubble cavitation during wafer cleaning process;

FIGS. 4A-4B depict a transit cavitation damaging patterned structure on a wafer during cleaning process;

FIGS. 5A-5C depict thermal energy variation inside bubble during cleaning process;

FIGS. 6A-6C depict an exemplary wafer cleaning method;

FIGS. 7A-7C depict another exemplary wafer cleaning method;

FIGS. 8A-8D depict another exemplary wafer cleaning method;

FIGS. 9A-9D depict another exemplary wafer cleaning method;

FIGS. 10A-10B depict another exemplary wafer cleaning method;

FIGS. 11A-11B depict another exemplary wafer cleaning method;

FIGS. 12A-12B depict another exemplary wafer cleaning method;

FIGS. 13A-13B depict another exemplary wafer cleaning method;

FIGS. 14A-14B depict another exemplary wafer cleaning method;

FIGS. 15A-15C depict a stable cavitation damaging patterned structure on a wafer during cleaning process;

FIG. 16 depicts another exemplary wafer cleaning apparatus using ultra/mega sonic device; and

FIG. 17 depicts an exemplary wafer cleaning apparatus using ultra/mega sonic device;

FIGS. 18A-18C depict another exemplary wafer cleaning method;

FIG. 19 depicts another exemplary wafer cleaning method;

FIG. 20A to FIG. 20D depict bubbles in the status of below the saturation point in the feature of vias or trenches;

FIG. 20E to FIG. 20H depict the size of bubbles expanded by the ultra/mega sonic device to result in the ratio R of total bubbles volume V_(B) to the volume of via, trench or recessed space V_(VTR) being closed to or above the saturation point;

FIG. 20I and FIG. 20J depict the size of bubbles expanded by the ultra/mega sonic device within a limitation to result in the ratio R of total bubbles volume V_(B) to the volume of via, trench or recessed space V_(VTR) being much below the saturation point;

FIGS. 21A-21D depict an exemplary substrate cleaning method;

FIGS. 22A-22D depict another exemplary substrate cleaning method;

FIGS. 23A-23C depict another exemplary substrate cleaning method.

DETAILED DESCRIPTION

FIGS. 1A to 1B show a wafer cleaning apparatus using a ultra/mega sonic device. The wafer cleaning apparatus consists of wafer 1010, wafer chuck 1014 being rotated by rotation driving mechanism 1016, nozzle 1012 delivering cleaning chemicals or de-ionized water 1032, and ultra/mega sonic device 1003 and ultra/mega sonic power supply. The ultra/mega sonic device 1003 further consists of piezoelectric transducer 1004 acoustically coupled to resonator 1008. Transducer 1004 is electrically excited such that it vibrates and the resonator 1008 transmits high frequency sound energy into liquid. The bubble cavitation generated by the ultra/mega sonic energy oscillates particles on wafer 1010. Contaminants are thus vibrated away from the surfaces of the wafer 1010, and removed from the surfaces through the flowing liquid 1032 supplied by nozzle 1012.

FIGS. 2A to 2G show top view of ultra/mega sonic devices according to the present invention. Ultra/mega sonic device 1003 shown in FIG. 1 can be replaced by different shape of ultra/mega sonic devices 3003, i.e. triangle or pie shape as shown in FIG. 2A, rectangle as shown in FIG. 2B, octagon as shown in FIG. 2C, elliptical as shown in FIG. 2D, half circle as shown in FIG. 2E, quarter circle as shown in FIG. 2F, and circle as shown in FIG. 2G.

FIG. 3A shows a bubble cavitation during compression phase. The shape of bubbler is gradually compressed from a spherical shape A to an apple shape G, finally the bubble reaches to an implosion status I and forms a micro jet. As shown in FIGS. 4A and 4B, the micro jet is very violent (can reaches a few thousands atmospheric pressures and a few thousands ° C.), which can damage the fine patterned structure 4034 on the semiconductor wafer 4010, especially when the feature size t shrinks to 70 nm and smaller.

FIGS. 5A to 5C show simplified model of bubble cavitation according to the present invention. As sonic positive pressure acting on the bubble, the bubble reduces its volume. During this volume shrinking process, the sonic pressure P_(M) did a work to the bubble, and the mechanical work converts to thermal energy inside the bubble, therefore temperature of gas and/or vapor inside bubble increases.

The idea gas equation can be expressed as follows: p ₀ v ₀ /T ₀ =p _(v) /T  (1)

where, p₀ is pressure inside bubbler before compression, v₀ initial volume of bubble before compression, T₀ temperature of gas inside bubbler before compression, p is pressure inside bubbler in compression, v volume of bubble in compression, T temperature of gas inside bubbler in compression.

In order to simplify the calculation, assuming the temperature of gas is no change during the compression or compression is very slow and temperature increase is cancelled by liquid surrounding the bubble. So that the mechanical work w_(m) did by sonic pressure P_(M) during one time of bubbler compression (from volume N unit to volume 1 unit or compression ratio=N) can be expressed as follows:

$\begin{matrix} {w_{m} = {{\int_{0}^{x_{0} - 1}{{pSdx}{\int_{0}^{x_{0} - 1}{\left( {{S\left( {x_{0}p_{0}} \right)}/\left( {x_{0} - x} \right)} \right){dx}}}}} = {{{Sx}_{0}p_{0}{\int_{0}^{x_{0} - 1}{{dx}/\left( {x_{0} - x} \right)}}} = {{{{- {Sx}_{0}}p_{0}{\ln\left( {x_{0} - x} \right)}}|_{0}^{x_{0} - 1}} = {{Sx}_{0}p_{0}{\ln\left( x_{0} \right)}}}}}} & (2) \end{matrix}$ Where, S is area of cross section of cylinder, x₀ the length of the cylinder, p₀ pressure of gas inside cylinder before compression. The equation (2) does not consider the factor of temperature increase during the compression, so that the actual pressure inside bubble will be higher due to temperature increase. Therefore the actual mechanical work conducted by sonic pressure will be larger than that calculated by equation (2).

If assuming all mechanical work did by sonic pressure is partially converted to thermal energy and partially converted mechanical energy of high pressure gas and vapor inside bubble, and such thermal energy is fully contributed to temperature increase of gas inside of bubbler (no energy transferred to liquid molecules surrounding the bubble), and assuming the mass of gas inside bubble staying constant before and after compression, then temperature increase ΔT after one time of compression of bubble can be expressed in the following formula: ΔT=Q/(mc)=βw _(m)/(mc)=βSx ₀ p ₀ ln(x ₀)/(mc)  (3) where, Q is thermal energy converted from mechanical work, β ratio of thermal energy to total mechanical works did by sonic pressure, m mass of gas inside the bubble, c gas specific heat coefficient. Substituting β=0.65, S=1E−12 m², x₀=1000 μm=1E−3 m (compression ratio N=1000), p₀=1 kg/cm²=1E4 kg/m², m=8.9E−17 kg for hydrogen gas, c=9.9E3J/(kg ° k) into equation (3), then ΔT=50.9° k. The temperature T₁ of gas inside bubbler after first time compression can be calculated as T ₁ =T ₀ +ΔT=20° C.+50.9° C.=70.9° C.  (4)

When the bubble reaches the minimum size of 1 micron as shown in FIG. 5B. At such a high temperature, of cause some liquid molecules surrounding bubble will evaporate. After then, the sonic pressure become negative and bubble starts to increase its size. In this reverse process, the hot gas and vapor with pressure P_(G) will do work to the surrounding liquid surface. At the same time, the sonic pressure P_(M) is pulling bubble to expansion direction as shown in FIG. 5C, therefore the negative sonic pressure P_(M) also do partial work to the surrounding liquid too. As the results of the joint efforts, the thermal energy inside bubble cannot be fully released or converted to mechanical energy, therefore the temperature of gas inside bubble cannot cool down to original gas temperature T₀ or the liquid temperature. After the first cycle of cavitation finishes, the temperature T₂ of gas in bubble will be somewhere between T₀ and T₁ as shown in FIG. 6B. Or T₂ can be expressed as T ₂ =T1−δT=T ₀ =ΔT−δT  (5)

Where δT is temperature decrease after one time of expansion of the bubble, and δT is smaller than ΔT.

When the second cycle of bubble cavitation reaches the minimum bubble size, the temperature T3 of gas and or vapor inside bubbler will be T3=T2+ΔT=T ₀ +ΔT−δT+ΔT=T ₀+2ΔT−δT  (6)

When the second cycle of bubble cavitation finishes, the temperature T4 of gas and/or vapor inside bubbler will be T4=T3−δT=T ₀+2ΔT−δT−δT=T ₀+2ΔT−2δT  (7)

Similarly, when the nth cycle of bubble cavitation reaches the minimum bubble size, the temperature T_(2n−1) of gas and or vapor inside bubbler will be T _(2n−1) =T ₀ +nΔT−(n−1)δT  (8)

When the nth cycle of bubble cavitation finishes, the temperature T_(2n) of gas and/or vapor inside bubbler will be T _(2n) =T ₀ +nΔT−nδT=T ₀ +n(ΔT−δT)  (9)

As cycle number n of bubble cavitation increase, the temperature of gas and vapor will increase, therefore more molecules on bubble surface will evaporate into inside of bubble 6082 and size of bubble 6082 will increase too, as shown in FIG. 6C. Finally the temperature inside bubble during compression will reach implosion temperature T_(i) (normally T_(i) is as high as a few thousands ° C.), and violent micro jet 6080 forms as shown in FIG. 6C.

From equation (8), implosion cycle number n_(i) can be written as following: n _(i)=(T _(i) −T ₀ −ΔT)/(ΔT−δT)+1  (10)

From equation (10), implosion time τ_(i) can be written as following:

$\begin{matrix} \begin{matrix} {\tau_{i} = {{n_{i}t_{1}} = {t_{1}\left( {{\left( {T_{i} - T_{0} - {\Delta\; T}} \right)/\left( {{\Delta\; T} - {\delta\; T}} \right)} + 1} \right)}}} \\ {= {{n_{i}/f_{i}} = {\left( {{\left( {T_{i} - T_{0} - {\Delta\; T}} \right)/\left( {{\Delta\; T} - {\delta\; T}} \right)} + 1} \right)f_{1}}}} \end{matrix} & (11) \end{matrix}$ Where, t₁ is cycle period, and f₁ frequency of ultra/mega sonic wave.

According to formulas (10) and (11), implosion cycle number ni and implosion time τ_(i) can be calculated. Table 1 shows calculated relationships among implosion cycle number n_(i), implosion time τ_(i) and (ΔT−δT), assuming Ti=3000° C., ΔT=50.9° C., T₀=20° C., f₁=500 KHz, f₁=1 MHz, anx f₁=2 MHz.

TABLE 1 ΔT-δT (° C.) 0.1 1 10 30 50 n_(i) 29018 2903 291 98 59 τ_(i)(ms) 58.036 5.806 0.582 0.196 0.118 f₁ = 500 KHz τ_(i)(ms) 29.018 2.903 0.291 0.098 0.059 f₁ = 1 MHz τ_(i)(ms) 14.509 1.451 0.145 0.049 0.029 f₁ = 2 MHz

In order to avoid damage to patterned structure on wafer, a stable cavitation must be maintained, and the bubble implosion or micro jet must be avoided. FIGS. 7A to 7C shows a method to achieve a damage free ultra or mega-sonic cleaning on a wafer with patterned structure by maintaining a stable bubble cavitation according to the present invention. FIG. 7A shows waveform of power supply outputs, and FIG. 7B shows the temperature curve corresponding to each cycle of cavitation, and FIG. 7C shows the bubble size expansion during each cycle of cavitation. Operation process steps to avoid bubble implosion according to the present invention are disclosed as follows:

Step 1: Put ultra/mega sonic device adjacent to surface of wafer or substrate set on a chuck or tank;

Step 2: Fill chemical liquid or gas (hydrogen, nitrogen, oxygen, or CO₂) doped water between wafer and the ultra/mega sonic device;

Step 3: Rotate chuck or oscillate wafer;

Step 4: Set power supply at frequency f₁ and power P₁;

Step 5: Before temperature of gas and vapor inside bubble reaches implosion temperature (or time reach τ₁<τ_(i) as being calculated by equation (11)), set power supply output to zero watts, therefore the temperature of gas inside bubble start to cool down since the temperature of liquid or water is much lower than gas temperature.

Step 6: After temperature of gas inside bubble decreases to room temperature T₀ or time (zero power time) reaches τ₂, set power supply at frequency f₁ and power P₁ again.

Step 7: repeat Step 1 to Step 6 until wafer is cleaned.

In step 5, the time τ₁ must be shorter than τ_(i) in order to avoid bubble implosion, and τ_(i) can be calculated by using equation (11).

In step 6, the temperature of gas inside bubble is not necessary to be cooled down to room temperature or liquid temperature; it can be certain temperature above room temperature or liquid temperature, but better to be significantly lower than implosion temperature T_(i).

According to equations 8 and 9, if (ΔT−δT) can be known, the τ_(i) can be calculated. But in general, (ΔT−δT) is not easy to be calculated or measured directly. The following method can determine the implosion time τ_(i) experimentally.

Step 1: Based on Table 1, choosing 5 different time τ₁ as design of experiment (DOE) conditions,

Step 2: choose time τ₂ at least 10 times of τ₁, better to be 100 times of τ₁ at the first screen test

Step 3: fix certain power P₀ to run above five conditions cleaning on specific patterned structure wafer separately. Here, P₀ is the power at which the patterned structures on wafer will be surely damaged when running on continuous mode (non-pulse mode).

Step 4: Inspect the damage status of above five wafers by SEMS or wafer pattern damage review tool such as AMAT SEM vision or Hitachi IS3000, and then the implosion time τ_(i) can be located in certain range.

Step 1 to 4 can be repeated again to narrow down the range of implosion time τ_(i). After knowing the implosion time τ_(i), the time τ₁ can be set at a value smaller than 0.5τ_(i) for safety margin. One example of experimental data is described as following.

The patterned structures are 55 nm poly-silicon gate lines. Ultra/mega sonic wave frequency was 1 MHz, and ultra/mega-sonic device manufactured by Prosys was used and operated in a gap oscillation mode (disclosed by PCT/CN2008/073471) for achieving better uniform energy dose within wafer and wafer to wafer. Other experimental parameters and final pattern damage data are summarized in Table 2 as follows:

TABLE 2 CO₂ Power Number conc. Process Density of Wafer (18 μs/ Time (Watts/ Cycle τ₁ τ₂ Damage ID cm) (sec) cm2) Number (ms) (ms) Sites #1 18 60 0.1 2000 2 18 1216 #2 18 60 0.1 100 0.1 0.9 0

It was clear that the τ₁=2 ms (or 2000 cycle number) introduced as many as 1216 damage sites to patterned structure with 55 nm feature size, but that the τ₁=0.1 ms (or 100 cycle number) introduced zero (0) damage sites to patterned structure with 55 nm feature size. So that the τ_(i) is some number between 0.1 ms and 2 ms, more detail tests need to be done to narrow its range. Obviously, the cycle number related to ultra or mega sonic power density and frequency, the larger the power density, the less the cycle number; and the lower the frequency, the less the cycle number. From above experimental results, we can predict that the damage-free cycle number should be smaller than 2,000, assuming the power density of ultra or mega sonic wave is larger than 0.1 wattsorcm², and frequency of ultra or mega sonic wave is equal to or less than 1 MHz. If the frequency increases to a range larger than 1 MHz or power density is less than than 0.1 watts/cm², it can be predicted that the cycle number will increase.

After knowing the time τ₁, then the time τ₂ can be shorten based on similar DEO method described above, i.e. fix time τ₁, gradually shorten the time τ₂ to run DOE till damage on patterned structure being observed. As the time τ₂ is shorten, the temperature of gas and or vapor inside bubbler cannot be cooled down enough, which will gradually shift average temperature of gas and vapor inside bubbler up, eventually it will trigger implosion of bubble. This trigger time is called critical cooling time. After knowing critical cooling time τ_(c), the time τ₂ can be set at value larger than 2τ_(c) for the same reason to gain safety margin.

FIGS. 8A to 8D show another embodiment of wafer cleaning method using a ultra/mega sonic device according to the present invention. The method is similar to that shown in FIG. 7A, except in step 4 setting ultra/mega sonic power supply at frequency f₁ and power with changing amplitude of waveform. FIG. 8A shows another cleaning method of setting ultra/mega sonic power at frequency f₁ and power with increasing amplitude of waveform in step 4. FIG. 8B shows another cleaning method of setting ultra/mega sonic power supply at frequency f₁ and power with decreasing amplitude of waveform in step 4. FIG. 8C shows another cleaning method of setting ultra/mega sonic power supply at frequency f₁ and power with decreasing first and increasing later amplitude of waveform in step 4. FIG. 8D shows further another cleaning method of setting ultra/mega sonic power at frequency f₁ and power with increasing first and decreasing later amplitude of waveform in step 4.

FIGS. 9A to 9D show another embodiment of wafer cleaning method using a ultra/mega sonic device according to the present invention. The method is similar to that shown in FIG. 7A, except in step 4 setting ultra/mega sonic power supply at changing frequency. FIG. 9A shows another cleaning method of setting ultra/mega sonic power supply at frequency f₁ first then frequency f₃ later, f₁ is higher than f₃ in step 4. FIG. 9B shows another cleaning method of setting ultra/mega sonic power supply at frequency f₃ first then frequency f₁ later, f₁ is higher than f₃ in step 4. FIG. 9C shows another cleaning method of setting ultra/mega sonic power supply at frequency f₃ first, frequency f₁ later and f₃ last, f₁ is higher than f₃ in step 4. FIG. 9D shows another cleaning method of setting ultra/mega sonic power supply at frequency f₁ first, frequency f₃ later and f₁ last, f₁ is higher than f₃ in step 4.

Similar to method shown in FIG. 9C, the ultra/mega sonic power can be set at frequency f₁ first, at frequency f₃ later and at frequency f₄ at last in step 4, where f₄ is smaller than f₃, and f₃ is smaller than f₁.

Again similar to method shown in FIG. 9C, the ultra/mega sonic power can be set at frequency f₄ first, at frequency f₃ later and at frequency f₁ at last in step 4, where f₄ is smaller than f₃, and f₃ is smaller than f₁.

Again similar to method shown in FIG. 9C, the ultra/mega sonic power can be set at frequency f₁ first, at frequency f₄ later and at frequency f₃ at last in step 4, where f₄ is smaller than f₃, and f₃ is smaller than f₁.

Again similar to method shown in FIG. 9C, the ultra/mega sonic power can be set at frequency f₃ first, at frequency f₄ later and at frequency f₁ at last in step 4, where f₄ is smaller than f₃, and f₃ is smaller than f₁.

Again similar to method shown in FIG. 9C, the ultra/mega sonic power can be set at frequency f₃ first, at frequency f₁ later and at frequency f₄ at last in step 4, where f₄ is smaller than f₃, and f₃ is smaller than f₁.

Again similar to method shown in FIG. 9C, the ultra/mega sonic power can be set at frequency f₄ first, at frequency f₁ later and at frequency f₃ at last in step 4, where f₄ is smaller than f₃, and f₃ is smaller than f₁.

FIGS. 10A to 10B show another method to achieve a damage free ultra/mega-sonic cleaning on a wafer with patterned structure by maintaining a stable bubble cavitation in according to the present invention. FIG. 10A shows waveform of power supply outputs, and FIG. 10B shows the temperature curve corresponding to each cycle of cavitation. Operation process steps according to the present invention are disclosed as follows:

Step 1: Put ultra/mega sonic device adjacent to surface of wafer or substrate set on a chuck or tank;

Step 2: Fill chemical liquid or gas doped water between wafer and the ultra/mega sonic device;

Step 3: Rotate chuck or oscillate wafer;

Step 4: Set power supply at frequency f₁ and power P₁;

Step 5: Before temperature of gas and vapor inside bubble reaches implosion temperature T_(i), (total time τ₁ elapes), set power supply output at frequency f₁ and power P₂, and P₂ is smaller than P₁. Therefore the temperature of gas inside bubble start to cool down since the temperature of liquid or water is much lower than gas temperature.

Step 6: After temperature of gas inside bubble decreases to certain temperature close to room temperature T₀ or time (zero power time) reach τ₂, set power supply at frequency f₁ and power P₁ again.

Step 7: repeat Step 1 to Step 6 until wafer is cleaned.

In step 6, the temperature of gas inside bubble can not be cooled down to room temperature due to power P₂, there should be a temperature difference ΔT₂ existing in later stage of τ₂ time zone, as shown in FIG. 10B.

FIGS. 11A to 11B show another embodiment of wafer cleaning method using a ultra/mega sonic device according to the present invention. The method is similar to that shown in FIG. 10A, except in step 5 setting ultra/mega sonic power at frequency f₂ and power P₂, where f₂ is lower than f₁ and P₂ is less than P₁. Since f₂ is lower than f₁, the temperature of gas or vapor inside bubble increasing faster, therefore the P2 should be set significantly less than P1, better to be 5 or 10 times less in order to reduce temperature of gas and or vapor inside bubble.

FIGS. 12A to 12B show another embodiment of wafer cleaning method using a ultra/mega sonic device according to the present invention. The method is similar to that shown in FIG. 10A, except in step 5 setting ultra/mega sonic power at frequency f₂ and power P₂, where f₂ is higher than f₁, and P₂ is equal to P₁.

FIGS. 13A to 13B show another embodiment of wafer cleaning method using a ultra/mega sonic device according to the present invention. The method is similar to that shown in FIG. 10A, except in step 5 setting ultra/mega sonic power at frequency f₂ and power P₂, where f₂ is higher than f₁, and P₂ is less than P₁.

FIGS. 14A-14B shows another embodiment of wafer cleaning method using a ultra/mega sonic device according to the present invention. The method is similar to that shown in FIG. 10A, except in step 5 setting ultra/mega sonic power at frequency f₂ and power P₂, where f₂ is higher than f₁, and P₂ is higher than P₁. Since f₂ is higher than f₁, the temperature of gas or vapor inside bubble increasing slower, therefore the P2 can be slightly higher than P1, but must make sure the temperature of gas and vapor inside bubbler decreases in time zone τ₂ comparing to temperature zone τ₁, as shown in FIG. 14B.

FIGS. 4A and 4B show that patterned structure is damaged by the violent micro jet. FIGS. 15A and 15B show that the stable cavitation can also damage the patterned structure on wafer. As bubble cavitation continues, the temperature of gas and vapor inside bubble increases, therefore size of bubble 15046 also increases as shown in FIG. 15A. When size of bubble 15048 becomes larger than dimension of space W in patterned structure as shown in FIG. 15B, the expansion force of bubble cavitation can damage the patterned structure 15034 as shown in FIG. 15C. Another cleaning method according to the present invention are disclosed as follows:

Step 1: Put ultra/mega sonic device adjacent to surface of wafer or substrate set on a chuck or tank;

Step 2: Fill chemical liquid or gas doped water between wafer and the ultra/mega sonic device;

Step 3: Rotate chuck or oscillate wafer;

Step 4: Set power supply at frequency f₁ and power P₁;

Step 5: Before size of bubble reaches the same dimension of space W in patterned structures (time τ₁ elapse), set power supply output to zero watts, therefore the temperature of gas inside bubble starts to cool down since the temperature of liquid or water is much lower than gas temperature;

Step 6: After temperature of gas inside bubble continues to reduce (either it reaches room temperature T₀ or time (zero power time) reach τ₂, set power supply at frequency f₁ power P₁ again;

Step 7: repeat Step 1 to Step 6 until wafer is cleaned;

In step 6, the temperature of gas inside bubble is not necessary to be cooled down to room temperature, it can be any temperature, but better to be significantly lower than implosion temperature T_(i). In the step 5, bubble size can be slightly larger than dimension of patterned structures as long as bubble expansion force does not break or damage the patterned structure. The time τ₁ can be determined experimentally by using the following method:

Step 1: Similar to Table 1, choosing 5 different time τ₁ as design of experiment (DOE) conditions,

Step 2: choose time τ₂ at least 10 times of τ₁, better to be 100 times of τ₁ at the first screen test

Step 3: fix certain power P₀ to run above five conditions cleaning on specific patterned structure wafer separately. Here, P₀ is the power at which the patterned structures on wafer will be surely damaged when running on continuous mode (non-pulse mode).

Step 4: Inspect the damage status of above five wafers by SEMS or wafer pattern damage review tool such as AMAT SEM vision or Hitachi IS3000, and then the damage time τ_(i) can be located in certain range.

Step 1 to 4 can be repeated again to narrow down the range of damage time τ_(d). After knowing the damage time τ_(d), the time τ₁ can be set at a value smaller than 0.5τ_(d) for safety margin.

All cleaning methods described from FIG. 7 to FIG. 14 can be applied in or combined with the method described in FIG. 15.

FIG. 16 shows a wafer cleaning apparatus using a ultra/mega sonic device. The wafer cleaning apparatus consists of wafer 16010, wafer chuck 16014 being rotated by rotation driving mechanism 16016, nozzle 16064 delivering cleaning chemicals or de-ionized water 16060, ultra/mega sonic device 16062 coupled with nozzle 16064, and ultra/mega sonic power supply. Ultra/mega sonic wave generated by ultra/mega sonic device 16062 is transferred to wafer through chemical or water liquid column 16060. All cleaning methods described from FIG. 7 to FIG. 15 can be used in cleaning apparatus described in FIG. 16.

FIG. 17 shows a wafer cleaning apparatus using a ultra/mega sonic device. The wafer cleaning apparatus consists of wafers 17010, a cleaning tank 17074, a wafer cassette 17076 holding the wafers 17010 and being held in the cleaning tank 17074, cleaning chemicals 17070, a ultra/mega sonic device 17072 attached to outside wall of the cleaning tank 17074, and a ultra/mega sonic power supply. At least one inlet fills the cleaning chemicals 17070 into the cleaning tank 17074 to immerse the wafers 17010. All cleaning methods described from FIG. 7 to FIG. 15 can be used in cleaning apparatus described in FIG. 17.

FIGS. 18A to 18C show another embodiment of wafer cleaning method using a ultra/mega sonic device according to the present invention. The method is similar to that shown in FIG. 7A, except in Step 5: Before temperature of gas and vapor inside bubble reaches implosion temperature T_(i), (or time reach τ₁<τ_(i) as being calculated by equation (11)), set power supply output to a positive value or negative DC value to hold or stop ultra/mega sonic device to vibrate, therefore the temperature of gas inside bubble start to cool down since the temperature of liquid or water is much lower than gas temperature. The positive value of negative value can be bigger, equal to or smaller than power P₁.

FIG. 19 shows another embodiment of wafer cleaning method using a ultra/mega sonic device according to the present invention. The method is similar to that shown in FIG. 7A, except in Step 5: Before temperature of gas and vapor inside bubble reaches implosion temperature T_(i), (or time reach τ₁<τ_(i) as being calculated by equation (11)), set power supply output at the frequency same as f₁ with reverse phase to f₁ to quickly stop the cavitation of bubble. Therefore the temperature of gas inside bubble start to cool down since the temperature of liquid or water is much lower than gas temperature. The positive value of negative value can be bigger, equal or less than power P₁. During above operation, the power supply output can be set at a frequency different from frequency f₁ with reverse phase to f₁ in order to quickly stop the cavitation of bubble.

As shown in FIG. 20A to FIG. 20D, the bubbles 20012 are in the status of below the saturation point in the feature of vias 20034 or trenches 20036 on a substrate 20010, so as to increase the fresh chemical exchange in the vias 20034 or trenches 20036 due to the bubble cavitation inside the features and also increase the removal of impurities such as residues and particles from the features. The saturation point R_(s) is defined by the largest amount of bubbles inside the features of vias, trenches or recessed areas. Over the saturation point, the chemical liquid is blocked by the bubbles inside the feature and hardly reaches to the bottom or side walls of the features of vias and trenches, so that the cleaning performance of the chemical liquid is influenced. While below the saturation point, the chemical liquid has enough feasibility inside the features of vias or trenches, and a good cleaning performance is achieved.

Below the saturation point, the ratio R of total bubbles volume V_(B) to the volume of via or trench, or recessed space V_(VTR) is: R=V _(V) /V _(VTR) <R _(s)

And at or above the saturation point R_(s), the ratio R of total bubbles volume V_(B) to the volume of via or trench, or recessed space V_(VTR) is: R=V _(B) /V _(VTR) =R _(s)

The volume of the total bubbles in the features of vias, trenches or recessed space: V_(B)=V_(Vb)

Wherein N is the total bubble numbers in the features and v_(b) is averaged single bubble volume.

As shown in FIG. 20E to FIG. 20H, the size of bubble 20012 expanded by the ultra/mega sonic device is gradually to a certain volume, which results in the ratio R of total bubbles volume V_(B) to the volume of via, trench or recessed space V_(VTR) is closed to or above the saturation point R_(s). It leads to the expanded bubble 20012 blocking in the vias or trenches, where is the path of chemical exchanges and impurities removal. In the case, the megasonic power cannot thoroughly transfer into the vias or trenches to reach their bottom and sidewall, meanwhile, the particles, residues and other impurities 20048 trapped in the vias or trenches cannot go out efficiently. This case easily occurs as the critical dimension W1 decreasing smaller, and the bubbles in the features of vias and trenches intends to be saturated after being expanded.

As shown in FIG. 20I to FIG. 20J, the size of bubble 20012 is expanded by the ultra/mega sonic device within a limitation, and the ratio R of total bubbles volume V_(B) to the volume of via, trench or recessed space V_(VTR) is much below the saturation point. The fresh chemical 20047 exchanges freely in the vias or trenches due to the bubble cavitation inside the features to achieve a good cleaning performance, meanwhile, the impurities 20048 such as residues and particles go out of the features of vias, trenches and recessed space.

Due to the total bubbles in the features is related to the bubble numbers and the bubble size in the features of vias and treches, the control of bubble size expanded by the cavitation is critical for the cleaning performance in the high aspect ratio features cleaning process.

As shown in FIG. 21A to FIG. 21D, after the first cycle of cavitation finishes, the volume of V₁ of gas in bubble is compressed to a minimum size smaller than V₀ during positive sonic power working on it, and the volume of V₂ of gas in bubble will be returned back during the negative sonic power working on it. However, the temperature T₂ in the bubble with the volume of V₂ is higher than the temperature T₀ in the bubble with the volume of V₀, as shown in FIG. 21B, so that the volume of V₂ is bigger than the volume of V₀ due to some liquid molecules surrounding bubble will evaporate under the high temperature. And the volume of V₃ by the second compression of the bubble is somewhere between V₁ and V₂, as shown in FIG. 21B. And V₁, V₂ and V₃ can be expressed as V ₁ =V ₀ −ΔV  (12) V ₂ =V ₁ +δV  (13) V ₃ =V ₂ −ΔV=V ₁ +δV−ΔV=V ₀ −ΔV+δV−ΔV=V ₀ +δV−2ΔV  (14)

Where ΔV is volume compression of bubble after one time of compression due to positive pressure generated by ultra/mega sonic wave, and δV is volume increase of the bubble after one time of expansion due to negative pressure generated by ultra/mega sonic wave, and δV−ΔV is volume increase due to temperature increment ΔT−δT as calculated in equation (5) after one time cycle.

After the second cycle of bubble cavitation, the size of bubble reaches to the larger bubble size during the temperature keeping increasing, the volume of V₄ of gas and or vapor inside bubbler will be V ₄ =V ₃ +δV=V ₀ +δV−2ΔV+δV=V ₀+2(δV−ΔV)  (15)

When the third cycle of bubble cavitation, the volume V₅ of gas and/or vapor inside bubbler will be V ₅ =V ₄ −ΔV=V ₀+2(δV−ΔV)−ΔV=V ₀+2δV−3ΔV  (16)

Similarly, when the nth cycle of bubble cavitation reaches the minimum bubble size, the volume V_(2n-1) of gas and or vapor inside bubbler will be V _(2n−1) =V ₀+(n−1)δV−nΔV=V ₀+(n−1)δV−nΔV  (17)

When the nth cycle of bubble cavitation finishes, the volume V_(2n) of gas and/or vapor inside bubbler will be V _(2n) =V ₀ +n(δV−ΔV)  (18)

To restrict the volume of bubble into a desired volume V_(i), which is a dimension with enough physical feasibility of movement or the bubbles status below the saturation point of cavitation or bubble density, rather than blocking the path of the chemical exchange in the features of vias, trenches or recessed areas, the cycle number n_(i) can be written as following: n _(i)=(V _(i) −V ₀ −ΔV)/(δV−ΔV)+1  (19)

From equation (19), the desired time τ_(i) to achieve the V_(i) can be written as following:

$\begin{matrix} \begin{matrix} {\tau_{i} = {{n_{i}t_{1}} = {t_{1}\left( {{\left( {V_{i} - V_{0} - {\Delta\; V}} \right)/\left( {{\delta\; V} - {\Delta\; V}} \right)} + 1} \right)}}} \\ {= {{n_{i}/f_{1}} = {\left( {{\left( {V_{i} - V_{0} - {\Delta\; T}} \right)/\left( {{\delta\; V} - {\Delta\; V}} \right)} + 1} \right)/f_{1}}}} \end{matrix} & (20) \end{matrix}$

Where, τ₁ is cycle period, and f₁ frequency of ultra/mega sonic wave.

According to formulas (19) and (20), a desired cycle number n_(i) and a time τ_(i) to restrict the bubble dimension can be calculated.

It should be pointed that when the cycle number n of bubble cavitation increases, the temperature of gas and liquid (water) vapor inside bubbler will increase, therefore more molecules on bubble surface will evaporate into inside of bubble, therefore the size of bubble 21082 will further increase and be bigger than value calculated by equation (18). In practical operation, since the bubble size will be determined by experimental method to be disclosed later, therefore bubble size impacted by the evaporation of liquid or water for bubble inner surface due to temperature increase will not be theoretically discussed in detail here. As the average single bubble volume keeping increasing, the ratio R of total bubbles volume V_(B) to the volume of via, trench or recessed space V_(VTR) increases from R₀ continuously, as shown in FIG. 21D.

As the bubble volume increases, the diameter of bubble eventually will reach the same size or same order size of feature W1 such as via as shown in FIG. 20E and trench or recessed area as shown in FIG. 20G. Then the bubble inside via and trench will block ultra/mega sonic energy further get into the bottom of via and trench, especially when the aspect ratio (depth/width) is larger than 3 time or more. Therefore contaminations or particles at bottom of such deep via or trench cannot be effectively removed or cleaned.

In order to avoid the bubble growth up to a critical dimension to block the path of chemical exchanges in the features of vias or trenches, FIGS. 22A to 22D disclose a method to achieve an effective ultra/mega sonic cleaning on a substrate with high aspect ratio features of vias or trenches by maintaining a restricted size bubble cavitation according to the present invention. FIG. 22A shows waveform of power supply outputs, and FIG. 22B shows the bubble volume curve corresponding to each cycle of cavitation, and FIG. 22C shows the bubble size expansion during each cycle of cavitation, and FIG. 22D shows the curve of the ratio R of total bubbles volume V_(B) to the volume of via, trench or recessed space V_(VTR). According to R=V _(B) /V _(VTR) =N _(Vb) /V _(VTR),

the ratio R of total bubbles volume V_(B) to the volume of via, trench or recessed space V_(VTR) increases from R₀ to R_(n), where the average single bubble volume being expanded by the sonic cavitation after a certain cycle number n, in the time of τ_(i). And the R_(n) is controlled below the saturation point R_(s), R _(n) =V _(B) /V _(VTR) =N _(Vb) /V _(VTR) <R _(S). And the ratio R of total bubbles volume V_(B) to the volume of via, trench or recessed space V_(VTR) decreases from R_(n) to R₀, where the average single bubble volume return to original size in the cooling process in the time of τ₂.

Operation process steps to avoid bubble size growth up according to the present invention are disclosed as follows:

Step 1: Put ultra/mega sonic device adjacent to surface of substrate or substrate set on a chuck or tank;

Step 2: Fill chemical liquid or gas (hydrogen, nitrogen, oxygen, or CO₂) doped water between substrate and the ultra/mega sonic device;

Step 3: Rotate chuck or oscillate substrate;

Step 4: Set power supply at frequency f₁ and power P₁;

Step 5: After the volume of bubble expands to a certain volume V_(n) or diameter w, (or time reach τ₁), set power supply output to zero watts, therefore the volume of gas inside bubble start to shrink down since the temperature of liquid or water cooling down the gas temperature;

Step 6: After the volume of bubble decreases to original volume while the gas temperature decreasing to room temperature T₀ or time (zero power time) reaches τ₂, set power supply at frequency f₁ and P₁ again;

Step 7: repeat Step 1 to Step 6 until substrate is cleaned.

In step 5, the expanded bubble's volume of V_(n) or diameter w is not necessary to be restricted to be smaller than the dimension V_(i) or feature size w1 that blocking the features of vias or trenches. It can be certain volume above the V_(i), but better to be smaller than the dimension V_(i) in order to obtain an effective cleaning with shortest process time. And the τ₁ is also not necessary to be restricted to be smaller than τ_(i), but better to be smaller than the τ_(i) as being defined in the equation (20).

In step 6, the volume of bubble is not necessary to shrink down to an original volume. It can be certain volume above original volume, but better to be significantly smaller than the V_(i) to restrict bubble size to get ultra/mega sonic power to be transmitted to the bottom of features such as via, trench, or recessed area.

FIG. 22B shows that the bubble is expanded into a big volume V_(n) by the ultra/mega sonic power working on it during a time τ₁. At this state, the path of mass transfer is partially blocked. And then the fresh chemical cannot thoroughly transfer into the vias or trenches to reach their bottom and sidewall, meanwhile, the particles, residues and other impurities trapped in the vias or trenches cannot go out efficiently. But the state will alternate into the next state for bubble shrinking: when the ultra/mega sonic power is off for cooling the bubble during a time τ₂ as shown in FIG. 22A. In this cooling state, the fresh chemical has chance to transfer into the vias or trenches so as to clean their bottom and sidewall. When the ultra/mega sonic power is on in the next on cycle, the particles, residues and other impurities can be removed out of the vias or trenches by pull out force generated by bubble volume increment. If the two states are alternating in a cleaning process, it achieves a performance of an effective ultra/mega sonic cleaning on a substrate with high aspect ratio features of vias or trenches or recessed areas.

The cooling state in the time τ₂ plays a key role in this cleaning process. It should be defined precisely. And the τ₁<τ_(i), time to restrict bubble size, is desired, and the definition of τ_(i) also is preferred. The following method can determine the time τ₂ to shrink bubble size during a cooling down state and time τ₁ to restrict the bubble expanded to the blockage size experimentally. The experiment is done by using an ultra/mega sonic device coupling with a chemical liquid to clean a pattern substrate with small features of vias and trenches, where the traceable residues exist to evaluate the cleaning performance.

Step 1: choose a τ₁ which is big enough to block the features, which can be calculation as τ_(i) based on the equation (20).

Step 2: choose different time τ₂ to run DOE. The selection of time τ₂ is at least 10 times of τ₁, better to be 100 times of τ₁ at the first screen test.

Step 3: Fix time τ₁ and fix certain power P₀ to run at least five conditions cleaning on specific patterned structure substrate separately. Here, P₀ is the power at which the features of vias or trenches on substrate will be surely not cleaned when running on continuous mode (non-pulse mode).

Step 4: Inspect the traceable residues status inside the features of vias or trenches of above five substrates by SEMS or element analyzer tool such as EDX.

The step 1 to step 4 can be repeated again to gradually shorten the time τ₂ till the traceable residues inside the features of vias or trenches are observed. As the time τ₂ is shorten, the volume of bubble cannot shrink down enough, which will gradually block the features and influence the cleaning performance. This time is called critical cooling time τ_(c). After knowing critical cooling time τ_(c), the time τ₂ can be set at value larger than 2τ_(c) to gain safety margin.

A more detail example is shown as follows:

Step 1: choosing 10 different time τ₁ as design of experiment (DOE) conditions, such as τ₁₀, 2τ₁₀, 4τ₁₀, 8τ₁₀, 16τ₁₀, 32τ₁₀, 64τ₁₀, 128τ₁₀, 512τ₁₀, as shown in Table 3;

Step 2: choosing time τ₂ at least 10 times of 512τ₁₀, better to be 20 times of 512τ₁₀ at the first screen test, as shown in Table 3;

Step 3: fixing certain power P₀ to run above ten conditions cleaning on specific patterned structure substrate separately. Here, P₀ is the power at which the features of vias or trenches on substrate will be surely not cleaned when running on continuous mode (non-pulse mode).

TABLE 3 Substrate# 1 2 3 4 5 6 7 8 9 10 τ₁ τ₁₀ 2τ₁₀ 4τ₁₀ 8τ₁₀ 16τ₁₀ 32τ₁₀ 64τ₁₀ 128τ₁₀ 256τ₁₀ 512τ₁₀ τ₂ 5120τ₁₀ 5120τ₁₀ 5120τ₁₀ 5120τ₁₀ 5120τ₁₀ 5120τ₁₀ 5120τ₁₀ 5120τ₁₀ 5120τ₁₀ 5120τ₁₀ Power P0 P0 P0 P0 P0 P0 P0 P0 P0 P0 Process Time T₀ T₀ T₀ T₀ T₀ T₀ T₀ T₀ T₀ T₀ Clean Status 1 2 3 4 5 6 5 4 4 3 of Features

Step 4: Using above conditions as shown in Table 3 to process 10 substrates with features of vias or trenches post plasma etching. The reason to choose the post plasma etched substrate is that the polymers generated during etching process are formed on sidewall of trench and via. Those polymers formed on the bottom or side wall of via are difficulty to remove by a conventional method. Then inspect the cleaning status of features of vias or trenches on the ten substrates by SEMS with crossing section of substrates. The data are shown in Table 3. From the Table 3, the cleaning effect reaches the best point of 6 at τ₁=32τ₁₀, therefore the optimum time τ₁ is 32τ₁₀.

If there is no peak to be found, then the step 1 to step 4 with board time setting of τ₁ can be repeated again to find the time τ₁. After find the initial τ₁, then step 1 to step 4 with time setting close to τ₁ can be repeated again to narrow down the range of time τ₁. After knowing the time τ₁, the time τ₂ can be optimized by reducing the time τ₂ from 512 τ₂ to a value till the cleaning effect is reduced. A detail procedure is disclosed as follows Table 4:

TABLE 4 Substrate# 1 2 3 4 5 6 7 8 τ₁ 32τ₁₀ 32τ₁₀ 32τ₁₀ 32τ₁₀ 32τ₁₀ 32τ₁₀ 32τ₁₀ 32τ₁₀ τ₂ 4096τ₁₀ 2048τ₁₀ 1024τ₁₀ 512τ₁₀ 256τ₁₀ 128τ₁₀ 64τ₁₀ 32τ₁₀ Power P0 P0 P0 P0 P0 P0 P0 P0 Process Time T₀ T₀ T₀ T₀ T₀ T₀ T₀ T₀ Clean Status 3 4 5 6 7 6 5 3 of Features

From the Table 4, the cleaning effect reaches the best point of 7 at τ₂=256τ₁₀, therefore the optimum time τ₂ is 256τ₁₀.

FIGS. 23A to 23C show another embodiment of substrate cleaning method using a ultra/mega sonic device according to the present invention. The method is similar to that shown in FIGS. 22A to 22D, except that power is still on for period of mτ₁ even the cavitation reaches a saturation point Rs. Here, m can be number from 0.1 to 100, preferred 2, which is depending on via and trench structure and chemicals, and it need to be optimized by experiment explained in embodiment as FIGS. 22A to 22D.

Method and apparatus disclosed in FIG. 8 to FIG. 14, and FIG. 16 to FIG. 19 can be applied in embodiments as shown in FIG. 22 and FIG. 23, it will not be described here again.

Generally speaking, an ultra/mega sonic wave with the frequency between 0.1 MHz˜10 MHz may be applied to the method disclosed in the present invention.

As described above, the present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f₁ and power P₁ to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency f₂ and power P₂ to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f₁ and power P₁ again; repeating above steps till the substrate being cleaned.

The first set value is below the cavitation saturation point. The second set value is much lower than the cavitation saturate point. The temperature inside bubble cooling down results in the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to the second set value. The temperature inside bubble cooling down to near temperature of said liquid.

At above embodiment, the first set value is a cavitation saturation point, and even after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate reaches to the cavitation saturation point, the ultra/mega sonic power supply is still kept at frequency f₁ and power P₁ for period of mτ₁, here τ₁ is the tme to reach the cavitation saturation point, m is multiples of τ₁, which is a number between 0.1 to 100, preferred 2.

According to an embodiment, the present invention discloses an apparatus for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device. The apparatus includes a chuck, an ultra/mega sonic device, at least one nozzle, an ultra/mega sonic power supply and a controller. The chuck holds a substrate. The ultra/mega sonic device is positioned adjacent to the substrate. The at least one nozzle injects chemical liquid on the substrate and a gap between the substrate and the ultra/mega sonic device. The controller sets the ultra/mega sonic power supply at frequency f₁ and power P₁ to drive the ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, the controller setting the ultra/mega sonic power supply at frequency f₂ and power P₂ to drive the ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, the controller setting the ultra/mega sonic power supply at frequency f₁ and power P₁ again; repeating above steps till the substrate being cleaned.

According to another embodiment, the present invention discloses an apparatus for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device. The apparatus includes a cassette, a tank, an ultra/mega sonic device, at least one inlet, an ultra/mega sonic power supply and a controller. The cassette holds at least one substrate. The tank holds the cassette. The ultra/mega sonic device is attached to outside wall of the tank. At least one inlet is used for filling chemical liquid into the tank to immerse the substrate. The controller sets the ultra/mega sonic power supply at frequency f₁ and power P₁ to drive the ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, the controller setting the ultra/mega sonic power supply at frequency f₂ and power P₂ to drive the ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, the controller setting the ultra/mega sonic power supply at frequency f₁ and power P₁ again; repeating above steps till the substrate being cleaned.

According to another embodiment, the present invention discloses an apparatus for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device. The apparatus includes a chuck, an ultra/mega sonic device, a nozzle, an ultra/mega sonic power supply and a controller. The chuck holds a substrate. The ultra/mega sonic device coupled with a nozzle is positioned adjacent to the substrate. The nozzle injects chemical liquid on the substrate. The controller sets the ultra/mega sonic power supply at frequency f₁ and power P₁ to drive the ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, the controller setting the ultra/mega sonic power supply at frequency f₂ and power P₂ to drive the ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, the controller setting the ultra/mega sonic power supply at frequency f₁ and power P₁ again; repeating above steps till the substrate being cleaned.

Although the present invention has been described with respect to certain embodiments, examples, and applications, it will be apparent to those skilled in the art that various modifications and changes may be made without departing from the invention. 

What is claimed is:
 1. A method for cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: applying liquid on the semiconductor wafer; controlling, based on a timer, a power supply of a transducer to deliver acoustic energy to the liquid at a first frequency value and a first power level value for a predetermined first time period, wherein sizes of bubbles inside the features increase during the first time period; and controlling, based on the timer, the power supply of the transducer to deliver acoustic energy to the liquid at a second frequency value and a second power level value for a predetermined second time period, wherein sizes of bubbles inside the features decrease during the second time period, wherein the first and second time periods are alternately applied one after another for a predetermined number of cycles, and wherein the first time period and the second time period are determined based on a ratio (R) of total bubbles volume (V_(B)) to volume (V_(VTR)) inside vias, trenches or recessed areas on the semiconductor wafer.
 2. The method of claim 1, wherein the first time period is further determined as a time period that achieves the highest number of cleaned features.
 3. The method of claim 2, wherein the first time period is determined by: placing traceable impurities on the semiconductor wafer; alternating between delivering acoustic energy to the liquid at the first frequency value and the first power level value for a test time period, and delivering acoustic energy to the liquid at the second frequency value and the second power level value for a sufficiently long time period; measuring a cleaning effect on the traceable impurities; repeating the above steps with a plurality of different test time periods; and determining the first time period as the test time period with the highest amount of removed traceable impurities.
 4. The method of claim 1, wherein the second time period is further determined as a time period that achieves the highest number of cleaned features.
 5. The method of claim 4, wherein the second time period is determined by: placing traceable impurities on the semiconductor wafer; alternating between delivering acoustic energy to the liquid at the first frequency value and the first power level value for a predetermined time period, and delivering acoustic energy to the liquid at the second frequency value and the second power level value for a test time period; measuring a cleaning effect on the traceable impurities; repeating the above steps with a plurality of different test time periods; and determining the second time period as the test time period with the highest amount of removed traceable impurities.
 6. The method of claim 1, wherein the first time period ends prior to at least one of the features being blocked by the bubbles.
 7. The method of claim 1, wherein the first time period ends after at least one of the features being blocked by the bubbles.
 8. The method of claim 1, wherein the second power level value is lower than the first power level value.
 9. The method of claim 8, wherein the second power level value is zero.
 10. The method of claim 1, wherein the second frequency value is higher than the first frequency value.
 11. The method of claim 1, wherein acoustic energy in the second time period is in antiphase to acoustic energy in the first time period.
 12. The method of claim 1, wherein the first frequency value is equal to the second frequency value, while the first power level value is higher than the second power level value.
 13. The method of claim 1, wherein the first frequency value is higher than the second frequency value, while the first power level value is higher than the second power level value.
 14. The method of claim 1, wherein the first frequency value is lower than the second frequency value, while the first power level value is equal to the second power level value.
 15. The method of claim 1, wherein the first frequency value is lower than the second frequency value, while the first power level value is higher than the second power level value.
 16. The method of claim 1, wherein the first frequency value is lower than the second frequency value, while the first power lever level value is lower than the second power level value.
 17. The method of claim 1, wherein the first power level value rises during the first time period.
 18. The method of claim 1, wherein the first power level value falls during the first time period.
 19. The method of claim 1, wherein the first power level value both rises and falls during the first time period.
 20. The method of claim 1, wherein the first frequency value changes from a higher value to a lower value during the first time period.
 21. The method of claim 1, wherein the first frequency value changes from a lower value to a higher value during the first time period.
 22. The method of claim 1, wherein the first frequency value changes from a lower value to a higher value and then back to the lower value during the first time period.
 23. The method of claim 1, wherein the first frequency value changes from a higher value to a lower value and then back to the higher value during the first time period.
 24. The method of claim 1, wherein the first frequency value is set as f₁ first, f₃ later and f₄ at last during the first time period, where f₄ is smaller than f₃, and f₃ is smaller than f₁.
 25. The method of claim 1, wherein the first frequency value is set as f₄ first, f₃ later and f₁ at last during the first time period, where f₄ is smaller than f₃, and f₃ is smaller than f₁.
 26. The method of claim 1, wherein the first frequency value is set as f₁ first, f₄ later and f₃ at last during the first time period, where f₄ is smaller than f₃, and f₃ is smaller than f₁.
 27. The method of claim 1, wherein the first frequency value is set as f₃ first, f₄ later and f₁ at last during the first time period, where f₄ is smaller than f₃, and f₃ is smaller than f₁.
 28. The method of claim 1, wherein the first frequency value is set as f₃ first, f₁ later and f₄ at last during the first time period, where f₄ is smaller than f₃, and f₃ is smaller than f₁.
 29. The method of claim 1, wherein the first frequency value is set as f₄ first, f₁ later and f₃ at last during the first time period, where f₄ is smaller than f₃, and f₃ is smaller than f₁.
 30. The method of claim 1, wherein the second frequency value is zero and the second power level value remains a constant positive value during the second time period.
 31. The method of claim 1, wherein the second frequency value is zero and the second power level value remains a constant negative value during the second time period.
 32. The method of claim 1, wherein the features comprise vias or trenches having depth to width ratios of at least
 3. 33. The method of claim 1, wherein a device manufacturing node of the semiconductor wafer is no more than 16 nanometers.
 34. The method of claim 1, further comprising rotating the wafer with respect to the transducer as acoustic energy is delivered.
 35. The method of claim 1, wherein the second time period ends after a ratio of total bubble volume inside the features falls much lower than a cavitation saturation point.
 36. The method of claim 1, wherein the first time period ends before a ratio of total bubble volume inside the features reaches a cavitation saturation point.
 37. The method of claim 1, wherein the first time period ends when a ratio of total bubble volume inside the features reaches a cavitation saturation point.
 38. The method of claim 1, wherein a duration of the first time period is mτ₁, where τ₁ is the time for a ratio of total bubble volume inside the features reaches a cavitation saturation point.
 39. The method of claim 38, wherein m is a value between 0.1 to
 100. 40. The method of claim 1, wherein temperatures inside the bubbles decrease in the second time period.
 41. The method of claim 40, wherein temperatures inside the bubble decrease to near a temperature of said liquid in the second time period.
 42. The method of claim 1, wherein the first time period is shorter than 2,000 times of a cycle period of the first frequency.
 43. The method of claim 1, wherein the first time period is shorter than ((V_(i)−V₀−ΔV)/(ΔV−δV)+1)/f₁, where V_(i) is a desired volume, V₀ is an original volume, ΔV is a volume compression of the bubble after one time of compression, δV is a volume increase of the bubble after one time of expansion, and f1 is the first frequency. 